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TOSHIBA UVM-450C

The machine main capacity : Processing the LED support mold ; Super Precise guide plate mold; The optical lens mold; Semiconductor association precise  parts

JAPAN WASINO PG

Super-hard materials forming grinding : accuracy can reach ±0.001mm. Hardness(HRA) of workpiece : 88°~92°.surface roughness of the workpiece :Rz≤0.2μm. Thermal Compensation of work-piece ≤2μm .

JAPAN SEIBU EDWs

High accuracy : ±0.002mm; high roughness : mirror surface machining roughness can reach RA≤0.2 ; high effectiveness : linear motor driven , good stability & accuracy .

MIRROR SURFACE EDMs

High speed , High efficiency , Low  weariness & Cost-efficient ; Super Accurate Surface , High Mirror Surface

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